TOYO Robotics Americas is excited to announce our participation in Semicon West 2026, North America's flagship gathering for semiconductor manufacturing, advanced packaging, and microelectronics technology. We invite all semiconductor engineers, machine designers, and technology leaders to visit us in San Francisco to experience the latest in sub-micron precision motion control.

Event Details

  • Show: Semicon West 2026
  • Location: Moscone Center, San Francisco, California
  • Dates: October 13 – 15, 2026
  • TOYO Booth: #5548

Driving the Future of Microelectronics

Semicon West brings together leading semiconductor companies, technology innovators, policymakers, engineers, researchers, and business leaders from around the globe to shape the future of microelectronics. As chip architectures demand tighter tolerances, smaller feature sizes, and higher throughput, high-precision motion control has become a foundational pillar of modern fab performance.

At Booth #5548, TOYO will showcase motion platforms engineered specifically for demanding fab environments—delivering the extreme rigidity, zero-backlash direct drive, and ISO Class 4 cleanroom compliance required for next-generation semiconductor fabrication.

TOYO AOI Inspection System

High-Precision Motion for Advanced Semiconductor Tasks

Whether your machine architecture requires high-speed scanning for Automated Optical Inspection (AOI), vibration-free FOUP transit, sub-micron wafer positioning, or rapid micro-bonding, TOYO provides tailored linear motion building blocks and complete positioning systems:

  • Direct-Drive Linear Motors: Sub-micron repeatability and non-contact operation eliminate mechanical backlash and particle wear in critical processing zones.
  • Cleanroom-Certified Actuators: ISO Class 4 compliant sealed linear stages equipped with integrated vacuum ports and specialized low-outgassing lubricants.
  • Granite & Air Bearing Architectures: Custom granite bases and non-contact air bearing stages designed to isolate environmental vibration and guarantee thermal stability.

Explore our dedicated Semiconductor Manufacturing Solutions hub for an in-depth breakdown of our wafer handling, FOUP transport, AOI inspection, and dicing applications.

Tailored Custom Systems & Engineering Expertise

Every semiconductor process tool carries unique spatial envelope, payload, and cleanroom integration constraints. In addition to our modular catalog components, TOYO specializes in co-engineering Custom Multi-Axis Systems tailored to your exact kinematic and environmental requirements.

Meet Our Engineering Team at Booth #5548

We warmly invite all engineers, machine builders, and system integrators to visit Booth #5548 at the Moscone Center during Semicon West 2026. Bring your motion control challenges, space constraints, and performance targets—our senior application engineers will be on-site to discuss custom motion architectures, payload dynamics, and integration strategies.

Want to schedule a dedicated technical review during the show?
Contact our technical engineering team today to reserve a one-on-one session at our booth.

We look forward to meeting you in San Francisco!